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FPC flexible circuit with 3M stiffener & dome

Short Description:

This is a 2 layer flexible PCB used for telecom 4G moudule. Pandawill manufacture single layer and double-sided and Multilayer up to 10 layers flexible circuits. The standard surface finish is HASL lead free and ENIG. Depending on the requirements, quantity and layout, contours are preferably cut by laser, but mechanical milling is also possible.


  • FOB Price: US $0.26/Piece
  • Min Order Quantity(MOQ): 1 PCS
  • Supply Capability: 100,000,000 PCS per month
  • Payment Terms: T/T/, L/C, PayPal
  • Product Detail

    Product Tags

    Product Details

    Layers 2 layers
    Board thickness 0.15MM
    Material Polyimide
    Copper thickness 1 OZ(35um)
    Surface Finish ENIG  immersion gold 
    Thickness of  the copper foil 18/18um
    Cu plated thickness 35um
    Hole Cu thickness 20um
    PI thickness 25um
    Coverlay thickness  37.5um 
    Stiffener 3M tape 9079; Steinless steel; Dome switch; thickness:0.375mm
    Min Hole(mm) 0.25mm  
    Min Line Width(mm) 0.20mm
    Min Line Space(mm) 0.18mm
    Solder Mask Yellow
     Legend Color White
    Mechanical processing Laser Cutting
    E-test Flying probe or Fixture
    Acceptance standard IPC-6013B; IPC-A-600H; ASF-WI-QA012; IPC-TM-650
    Application Telecom

    1. Introduction

    Flexible printed circuits

    Flexible printed circuits have become established in recent years as a medium for circuits.

    The main users of flexible printed circuits are the technological sectors which need the following characteristics and benefits:

    Implementation of compact, complex assemblies which minimise size and weight

    Dynamically and mechanically robust when bent

    Defined characteristics of the circuit systems on the circuit board (impedances and resistances)

    Reliability of the electrical connections by minimising the number of connections between the modules

    Saving connectors and wiring, also cost-saving by lowering the costs for component placement and assembly

     

    2. Materials

    Flexible base material: As a base material, PANDAWILL uses exclusively polyimide film which, compared to the alternative PET and PEN films has the advantage of a high processing temperature range, unrestricted solderability as well as the large operating temperature range. Depending on the requirements for the product and process, differing versions of film are used.

    Polyimide thickness   25 µm, 50 µm, 100 µm   PANDAWILL standard: 50 µm  
    Copper   Single or double sided    
      18 µm, 35 µm, 70 µm   PANDAWILL standard: 18 µm or 35 µm  
      Rolled copper (RA)   Suitable for dynamic, flexible applications  
      Electrolytically deposited copper (ED)   Low elongation after fracture, only suited for static and semi-dynamic applications  
    Adhesive systems   Acrylic adhesive   For dynamical, flexible applications, not UL 94 V-0 listed  
      Expoy adhesive   Limited dynamic flexibility, UL 94 V-0 listed  
      Adhesive free   PANDAWILL standard, high flexibility, chemical resistance, and is UL 94 V-0 listed  

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